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Microelectronics, electromagnetism, photonics , microwave

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cutting and polishing

Cutting

micro scie de découpe de substrats Silicium
A saw (Isomet 4000 / Buelher) allows to cut silicon wafers or glass substrates; a laser beam  is used for the alignment

Polishing machines

Polisseuse
the polishing can be made on machines Presi by using  abrasive disk with several granulometry from 45 to 0,3 microns

Lapping machine

Equipement Logitec
 
The substrates are thinned on an equipment  Logitec by lapping the surface with abrasive powder; thickness, uniformity and planarity can be controlled.

Written by Brigitte Rasolofoniaina

Date of update October 5, 2018

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IMEP-LAHC
Grenoble site
Grenoble INP - Minatec : 3, Parvis Louis Néel - CS 50257 - 38016 Grenoble Cedex 1

Chambéry site
Université de Savoie - F73376 Le Bourget du Lac Cedex
 


  CNRS  http://www.cnrs.fr      Site Grenoble-INP http://www.grenoble-inp.fr       Université Grenoble Alpes (UGA)      Université Savoie Mont Blanc
Univ. Grenoble Alpes