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cutting and polishing - Grenoble INP - IMEP-LAHC

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cutting and polishing

Cutting

micro scie de découpe de substrats Silicium
A saw (Isomet 4000 / Buelher) allows to cut silicon wafers or glass substrates; a laser beam  is used for the alignment

Polishing machines

Polisseuse
the polishing can be made on machines Presi by using  abrasive disk with several granulometry from 45 to 0,3 microns

Lapping machine

Equipement Logitec

The substrates are thinned on an equipment  Logitec by lapping the surface with abrasive powder; thickness, uniformity and planarity can be controlled.

 
IMEP-LAHC - UMR 5130
Site Grenoble
Grenoble INP - Minatec : 3, Parvis Louis Néel - CS 50257 - 38016 Grenoble Cedex 1

Site Chambéry
Université de Savoie - F73376 Le Bourget du Lac Cedex Copyright Grenoble INP