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Microelectronics, electromagnetism, photonics , microwave

> Platforms > Technology > Cutting/Polishing/Thinning/Lapping

cutting -polishing - thinning - lapping

Cut

Micro saw Isomet 4000
Micro saw Isomet 4000  Buelher  to cut silicon or glass

Polishing equipment

Polishing machine
Polishing machines Presi using  abrasive disk : 45 to 0,3 microns

Thinning, lapping

Equipment Logitec
Equipment  Logitec : control of  planarity, thickness

Date of update May 15, 2019

French
IMEP-LAHC
Grenoble site
Grenoble INP - Minatec : 3, Parvis Louis Néel - CS 50257 - 38016 Grenoble Cedex 1

Chambéry site
Université Savoie Mont Blanc - F73376 Le Bourget du Lac Cedex
 
 
               Université Grenoble Alpes (UGA)      Université Savoie Mont Blanc
Univ. Grenoble Alpes