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Microelectronics, electromagnetism, photonics , microwave

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Lithography

Resist and polymers deposition by spin coating:

Spin coater Süss Microtec TP6000
Substrates : max. diameter 4"
Hot plates for soft and hardbake
- Hot plates for soft and hardbake





UVPhotolithography:

UV Source:h-line / 405nm and i-line / 365nm
 UV Photolithography

Equipment Süss Microtec - MA6:

Equipment Süss Microtec - MA6
 
* Masks 4'' to 5"
* Substrates: max. diameter 3''
* Vacuum contact / Soft contact / Hard contact / Proximity :
   - Resolution : 0,6 micron
   - Alignement in BSA
 
 

Equipment Süss Microtec- MJB3:

Equipment Süss Microtec - MJB3

 
    * Masks 4 to 5"
    * Substrates: max diameter 3"
    * Vacuum contact / Soft contact :
           - Resolution : 1 micron
           - Alignement in BSA

 

Date of update May 10, 2019

French
IMEP-LAHC
Grenoble site
Grenoble INP - Minatec : 3, Parvis Louis Néel - CS 50257 - 38016 Grenoble Cedex 1

Chambéry site
Université Savoie Mont Blanc - F73376 Le Bourget du Lac Cedex
 
 
               Université Grenoble Alpes (UGA)      Université Savoie Mont Blanc
Univ. Grenoble Alpes