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Microelectronics, electromagnetism, photonics , microwave

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Metallic and dielectric layers deposition

Materials:     aluminium    gold            silicon        titan       ...
                   alumina       chromium    silica          tungsten
Gaz process : Ar, O2

Cathodic RF magnetron sputtering and Joule effect evaporation: PLASSYS - MEP 300

  •  Dry vacuum: 3.10-7 mbar
  • Substrates: max. diameter 3"
  • Temperature: Ambient to 250°C
  • 2 sources of evaporation
  • 1 place for target of sputtering 4"
    Sputtering deposition PDV equipment Plassys MEP 300

Joule effect evaporation - EDWARDS - E306A

PDV equipment Edwards E306A  
  * Vacuum  5.10-7 mbar  
  * Contrôle of rate of deposition and thickness
  * Substrates : max diameter 6 cm
  * IR heating : ambient  to 120°C 
 
                  
 

Cathodic RF magnetron sputtering- ALCATEL - SCM 600

PVD equipment Alcatel SCM600
 
 * Vacuum 2.10-7 mbar
 * 4 places for target sputtering  4"
 * 1 Substrate : max diameter 6 cm
 * Peltier effect heating : ambient to 250°C
 * Multilayers possible


 

Date of update May 16, 2019

French
IMEP-LAHC
Grenoble site
Grenoble INP - Minatec : 3, Parvis Louis Néel - CS 50257 - 38016 Grenoble Cedex 1

Chambéry site
Université de Savoie - F73376 Le Bourget du Lac Cedex
 


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Univ. Grenoble Alpes