HF measurements techniques,materials characterization, integrated passive devices & 3D integration

Research activities are performed according to four complementary topics, from materials and measurement techniques to elementary devices and their applications.

• 1- High frequency measurement methods:
  
  
• Calibration and de-embedding techniques for integrated device characterization
•  Wideband characterization techniques (DC to 110 GHz) of materials
•  In-situ techniques for characterization of very thin films (nm) to bulk (mm) materials
  

• 3- Development, design and characterization of new integrated passive devices and MEMS
  
  
• 3D RF MIM capacitors, new high density 3D capacitors (TSC, Nanowires capacitors)
•   High performance and tunable integrated capacitors
•  High speed Interconnections for sub-45 nm CMOS nodes
•  MEMS and sensors
  

• 4- 3D Integrated Circuits (3D-IC) and 3D packaging
  
  
• Modelling and characterisation of TSV, Pillars and RDL interconnections
• Architectures of 3D passives in 3D-IC stacks
  
• 3D interposer technologies
•  High speed interconnection channels for 3D integration (Wide I/O, HDMI...)