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Lithography, etching, chemistry - Grenoble INP - IMEP-LAHC

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Lithography, etching, chemistry

Photoresist and polymers deposition by spin coating

Spin coater Süss Microtec TP6000
  • Substrates up to 3 inches


PhotolithographyMask aligner Süss Microtec- type MA6:
  • * Mask 4 inches
  • * Substrates 3 inches
  • * Vacuum contact, hard/soft contact, proximity contact
    Features down to 0,6 micron
    High precision alignment stage


Wet Chemical etching

Thin layers etching, photoresist development

Dry chemical etching

Equipment Corial 200IL/ICP Equipment Corial 200IL RIE/ICP
Fluoride gases, plasma O2

Thermal treatment

Heating under vacuum or under controlled atmosphere (nitrogen)


Manipulation of acids or solvents for etching (HF ...), cleaning (F NO3, photoresist remover)...
Site Grenoble
Grenoble INP - Minatec : 3, Parvis Louis Néel - CS 50257 - 38016 Grenoble Cedex 1

Site Chambéry
Université de Savoie - F73376 Le Bourget du Lac Cedex Copyright Grenoble INP