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Platform IMEP-LaHC - Grenoble INP - IMEP-LAHC

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CEP : Physical and Electrical characterization


Caractérisation sous pointes de transistors

Thanks to a large group of competitive scientific equipments, IMEP-LAHC has a great knowledge in measurements allowing the study of electronic devices and of associated materials and technologies as well.

Contact : Xavier MESCOT

HOC : Microwaves Optomicrowaves and EMC platform


Test sous pointes hyperfréquences  à 110Ghz
This platform gathers all Microwaves, Microwave-photonics and EMC measurement equipments. It is shared between two sites : Grenoble and Le Bourget du Lac.
 High level measurement and characterization tools are kept at the researchers disposal : for coaxial and on wafer characterization up to 110 GHz, for microwave-photonics architecture solutions design in newest telecommunication systems and for electromagnetic radiation phenomenon's study.

Contact :Magali ASTIC Nicolas CORRAO

Photonics


Ban de mesure Gain - Perte
After their realization at our  fabrication component platform, the integrated optics chips must be carefully characterized.
Being intended for the domain of telecommunications and sensors, the performances of these optical chips must be measured as accurately as possible.
The IMEP has 9 dark rooms equipped with up-to-date equipments to realize these measurements:
 Multi axis positioning stages
- spectrum analyzers
- polarization analyzer
- infrared camera
- etc...

Contact : Gregory GROSA

Technological Platform


Préparattion d'échantillons en salle blanche
The components are elaborated in the 450 m² clean room situated in the Minatec center.
The technological equipments are those used in standard microelectronics processes: thin dielectric or metallic layers deposition by Joule effect evaporation and RF sputtering, photolithography, spin coating, mask transfer, photoresist development, thin film etching.
Since many years the laboratory has developed a technology of integrated optics based on ions exchange processes in diffusion furnaces; the integrated waveguides are buried in glass substrates by electrical assisted field diffusion.

Contact : Aude BOUCHARD
 
IMEP-LAHC - UMR 5130
Site Grenoble
Grenoble INP - Minatec : 3, Parvis Louis Néel - CS 50257 - 38016 Grenoble Cedex 1

Site Chambéry
Université de Savoie - F73376 Le Bourget du Lac Cedex Copyright Grenoble INP