Seminar of Thursday, December 19, 2013 ANNULE

Abstract:
The recent progress of semiconductor and integration technologies enabled the design and demonstration of high-performance and miniature millimeter-wave transceiver systems with applications in a variety of domains such as wireless communications, radars, remote sensing, or imaging. These applications are currently emerging in frequency bands spanning from 30 GHz up to 300 GHz or even 1 THz. In each case, the integration of transceiver modules combining antennas and RF integrated circuits in a single chip or package plays a critical role in meeting the application requirements in terms of budget link, power consumption, size and cost.
This presentation will focus on 60-GHz technologies, which will be used in multiple applications spanning from short-range indoor device-to-device communications, outdoor mobile access for future cellular wireless networks, or long-range point-to-point communications. The main technologies and challenges involved in the development of cost-effective integrated communication modules will be presented along with state-of-the-art demonstrations and recent achievements at CEA-LETI.