cutting -polishing - thinning - lapping

Cut

Micro saw Isomet 4000 Buelher to cut silicon or glass

Polishing equipment

Polishing machines Presi using abrasive disk : 45 to 0,3 microns

Thinning, lapping

Equipment Logitec : control of planarity, thickness

Date of update May 15, 2019

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Grenoble INP - Minatec : 3, Parvis Louis Néel - CS 50257 - 38016 Grenoble Cedex 1

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