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Microélectronique, électromagnétisme, photonique, hyperfréquences
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Microelectronics, electromagnetism, photonics , microwave
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Cutting/Polishing/Thinning/Lapping
cutting -polishing - thinning - lapping
Cut
Micro saw Isomet 4000 Buelher to cut silicon or glass
Polishing equipment
Polishing machines Presi using abrasive disk : 45 to 0,3 microns
Thinning, lapping
Equipment Logitec : control of planarity, thickness
Date of update May 15, 2019
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Photonics
Measures of Gain / losses
Mode profile
M-lines
Spectrum analysis
Bragg grating
HYPER
Microwave Instruments
Anechoid chamber
RF communication system over optical fiber
Radiofrequency PCB prototyping
ECLAT
Electromagnetism
Cryogenics
LAsers & Thz
Physical and electrical characterization
(I-V) / (C-V) measurements
Measurements of the transport properties
Noise measurements at low frequency
Nano-scaled Measurements
Technology
Thin films deposition
Lithography
Etching, Chemistry, Nanomaterials activities
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Cutting/Polishing/Thinning/Lapping
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Université Grenoble Alpes