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Microelectronics, electromagnetism, photonics , microwave
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Lithography
Lithography
Resist and polymers deposition by spin coating:
Spin coater Süss Microtec TP6000
Substrates : max. diameter 4"
- Hot plates for soft and hardbake
UVPhotolithography:
UV Source:h-line / 405nm and i-line / 365nm
Equipment Süss Microtec - MA6:
* Masks 4'' to 5"
* Substrates: max. diameter 3''
* Vacuum contact / Soft contact / Hard contact / Proximity :
- Resolution : 0,6 micron
- Alignement in BSA
Equipment Süss Microtec- MJB3:
* Masks 4 to 5"
* Substrates: max diameter 3"
* Vacuum contact / Soft contact :
- Resolution : 1 micron
- Alignement in BSA
Date of update May 10, 2019
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