Lithography, etching, chemistry

Spin coater Süss Microtec TP6000

• Substrates up to 3 inches

Mask aligner Süss Microtec- type MA6:

• * Mask 4 inches
• * Substrates 3 inches
• * Vacuum contact, hard/soft contact, proximity contact
  Features down to 0,6 micron
  High precision alignment stage
  
  
  
  
  
  

  Thin layers etching, photoresist development

Equipment Corial 200IL RIE/ICP
Fluoride gases, plasma O2

Heating under vacuum or under controlled atmosphere (nitrogen)

Manipulation of acids or solvents for etching (HF ...), cleaning (F NO3, photoresist remover)...